Electronic components, semiconductor materials and precision instruments rarely fail for one reason — temperature, humidity and static build on each other. Moisture-sensitive devices such as ICs and BGAs that go through reflow have a floor life once packaging is opened, and past that window they must be baked dry to standard; a static discharge below 100 volts is enough to punch through an oxide layer. The industry's answer is to manage all three lines at once (see ANSI/ESD S20.20 and IPC/JEDEC J-STD-020).
Precision instruments are more sensitive to temperature swings and vibration: fast temperature changes affect structural, optical and sensor parts, while vibration or tipping during handling and stacking threatens accuracy and appearance directly. These goods usually call for a stable climate, solid stacking and disciplined handling, with outer packaging kept intact.
Electronic materials are typically high-value, small and heavily numbered by model, so batch or serial-number records and same-day confirmation of packaging damage matter more than for general cargo. Those are the category's general expectations — check them one by one against our actual conditions; the specific ESD measures have to be agreed together with your packaging and handling methods.